Numerical Simulation of Temperature Field in Curing Process for Epoxy Resin Dry-type Transformer Winding[J]. High voltageapparatus, 2008, (5): 385-388.
Numerical Simulation of Temperature Field in Curing Process for Epoxy Resin Dry-type Transformer Winding[J]. High voltageapparatus, 2008, (5): 385-388.DOI:
In order to avoid crack faults and shrinkage of winding due to the changes in temperature field and stress field during the production process
a study was put up.By analyzing the reasons for forming faults and considering the performance of the winding material changing with temperature
the nonlinear analysis was adopted to build a 3-D finite element analysis model of transient temperature field and thermal-stress field during casting
curing
and cooling process of the dry-type transformer winding.The initial condition
boundary condition
and latent heat were then determined
thus the model could be applied in simulation of temperature and stress fields distribution in that process.The experimental results indicate that the numerical simulation coincide well with the actual dynamic changes of temperature and stress fields in casting
curing and cooling process of epoxy resin dry-type transformer winding
which will benefit the improvement of transformer performance and the reduction of cracks.