YU Xiao-ling1, WEI Yi-jiang1, LIU Zhi-yuan2, et al. Simulation Researches on Influence Factors of Temperature Rise in High Voltage Vacuum Circuit Breaker[J]. High voltageapparatus, 2007, (3): 179-182.
YU Xiao-ling1, WEI Yi-jiang1, LIU Zhi-yuan2, et al. Simulation Researches on Influence Factors of Temperature Rise in High Voltage Vacuum Circuit Breaker[J]. High voltageapparatus, 2007, (3): 179-182.DOI:
including heat transfer coefficients on radiating surfaces
radius and position of contact face between moving contact and stationary contact
and radius of current-conducting rod
had been simulated and analyzed by using a model of high voltage vacuum circuit breaker as research object.Simulation results show that the temperature of contact surface between moving contact and stationary contact decrease less than 5%
but the temperature of terminal decreased about 14% when the radiation on the heat sink surface is included.With the increasing of the contact surface radius between moving contact and stationary contact
the temperature rise of VCB decreasing rapidly
this is independent of its position.The temperature rise achieve saturated when the contact surface radius reach to 2 mm.With the increasing of the current-conduction rod radius
the temperature rise of VCB
especially the temperature rise of contact surface between moving contact and stationary contact decreasing.Thetemperature rise achieve saturated when the rod radius reach to 25 mm.