This paper describes the microstructure of copper-chromium contact and forming mechanism

the process factors affecting the crystallized structure as well as the influence of microstructure on electric properties. The copper-chromium contact melted with vacuum arc has the microstructure of homogeneous and fine chromium particles distributed dispersively in copper basis. The contact has many advantages in breaking capacity

anti-welding behaviour and dielectric recovery strength

compared with traditional powder metallurgy copper-chromium contact.