WANG Ya ping, DING Bing jun. EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS[J]. High voltageapparatus, 2002, (1): 4-7.DOI：
CuCr触头合金热扩散率的实验研究
摘要
用激光脉冲法测试了不同晶粒尺寸的CuCr合金和纯Cr样品的热扩散率
结果表明
高能球磨及真空热压方法制备的纳米晶材料的热扩散率较常规粗晶材料显著降低
Abstract
The thermal diffusivities for CuCr alloys and pure Cr samples with different grain size are measured by laser pulse method. The results show that the thermal diffusivities for nanocrystalline samples prepared by high energy milling and hot press procedures are obviously lower than those for conventional materials.
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