高导热复合绝缘材料制备研究进展：等离子体表面修饰

闫镜伊; 张传升; 孔飞; 王琨; 杨威; 程显; 邵涛

doi:10.13296/j.1001-1609.hva.2026.03.021

您当前的位置：

首页 >

文章列表页 >

高导热复合绝缘材料制备研究进展：等离子体表面修饰

研究与分析 | 更新时间：2026-03-11

- 高导热复合绝缘材料制备研究进展：等离子体表面修饰
- Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification
- 高压电器 2026年62卷第3期页码：171-182
- 作者机构：
  
  郑州大学电气与信息工程学院，郑州 450001
  中国科学院电工研究所等离子体科学和能源转化北京市国际科技合作基地，北京 100190
  中国科学院大学，北京 100190
  国网智能电网研究院有限公司，北京 102209
- 作者简介：
  
  闫镜伊（1996—），女，硕士研究生，主要研究方向为高导热绝缘复合材料制备。
  孔飞（1987—），男，博士，副研究员，主要研究方向为放电等离子体应用、先进功能电介质材料、高电压与绝缘技术（通信作者）（E-mail：kongfei@mail.iee.ac.cn）。
- 基金信息：
  
  国家自然科学基金智能电网联合基金项目;National Natural Science Foundation of China-State Grid Joint Fund for Smart Grid(U2166215);国家自然科学基金;National Natural Science Foundation of China(52177163;52507198;52237007);先进输电技术国家重点实验室开放基金项目资助。;State Key Laboratory of Advanced Power Transmission Technology(GEIRI-SKL-2021-008)
- DOI：10.13296/j.1001-1609.hva.2026.03.021
  中图分类号：
- 收稿：2025-07-18，
  
  修回：2025-09-19，
  
  纸质出版：2026-03-16
- 稿件说明：
移动端阅览
闫镜伊, 张传升, 孔飞, 等. 高导热复合绝缘材料制备研究进展：等离子体表面修饰[J]. 高压电器, 2026,62(3):171-182.

YAN Jingyi, ZHANG Chuansheng, KONG Fei, et al. Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification[J]. High Voltage Apparatus, 2026, 62(3): 171-182.
闫镜伊, 张传升, 孔飞, 等. 高导热复合绝缘材料制备研究进展：等离子体表面修饰[J]. 高压电器, 2026,62(3):171-182. DOI： 10.13296/j.1001-1609.hva.2026.03.021.

YAN Jingyi, ZHANG Chuansheng, KONG Fei, et al. Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification[J]. High Voltage Apparatus, 2026, 62(3): 171-182. DOI： 10.13296/j.1001-1609.hva.2026.03.021.

摘要

高性能绝缘材料应用广泛，在电气、电子等领域不可或缺。特别是，随着高压电工装备、微电子产品的迅猛发展，传统的绝缘材料难以满足趋于高度集成化发展的器件因单位功率密度显著提高而产生的散热需求，器件的稳定性以及寿命受到严重的影响。在高电压绝缘材料领域中，近年来高分子聚合物因其良好的电气绝缘性能被广泛关注，但其极低的导热性能限制了其在高散热场合下的应用，因此亟待开发高导热绝缘材料。文中首先综述了本征型和填充型复合绝缘材料的制备方法，其中填充型制备是现阶段常用的方案。在该方案中，界面热阻是限制导热性能得到良好提升的瓶颈问题。针对这一问题，相关学者对填料进行表面修饰，以增加填料与聚合物的界面相容性。据此文中全面总结现阶段常用的填料表面修饰方法，并着重对等离子体修饰的机理以及处理方式进行介绍。等离子体表面修饰是制备高导热复合材料的一种新途径和新思路，与现有工艺相结合，未来有望推动其工业化应用。

Abstract

High-performance insulation materials have wide application and are indispensable in electrical and electronic fields. In particular

with the rapid development of high voltage electrical equipment and microelectronic products

traditional insulation materials are hard to meet the heat dissipation requirements of devices that are evolving towards higher integration due to the significant increase in unit power density

and the stability and lifetime of devices are seriously affected. In the field of high voltage insulating materials

polymers are focused recently for their perfect electrical insulation properties. However

its extremely low thermal conductivity limits its application in high heat dissipation scenarios. Consequently

it is urgent to develop high thermal conductivity insulating materials. In this paper the preparation methods of intrinsic and filled composite insulating materials are comprehensively described

in which the lattern scheme is at present stage the commonly used scheme. In the scheme

the interfacial thermal resistance is the key issue that limits the improvement of thermal conductivity. Regarding this issue

surface modification of the filler is performed by relevant researchers to increase the interfacial compatibility between the filler and the polymer. On this basis

in this paper surface modification methods for fillers which are commonly used at presetn stage are comprehensively summarized

and the mechanism of plasma modification and the modification process are introduced in particular. Plasma surface modification is a new approach and idea for the preparation of high thermal conductivity composites wich

combined with existing processes

is expected to promote industrial applications in the future.

关键词

Keywords

references

黄兴溢,江平开.聚合物绝缘与功能电介质材料的若干研究热点述评[J].绝缘材料,2016,49(9):1-9.

HUANG Xingyi,JIANG Pingkai.Review of some hot topics on electrically insulating and dielectric polymer materials[J]. Insulating Materials,2016,49(9):1-9.

杜伯学,孔晓晓,李进,等.高导热环氧树脂复合电介质研究现状[J].绝缘材料,2017,50(8):1-8.

DU Boxue,KONG Xiaoxiao,LI Jin,et al.Research status of epoxy resin composite dielectric with high thermal conductivity[J]. Insulating Materials,2017,50(8):1-8.

ZHANG Li, DENG Hua, FU Qiang.Recent progress on thermal conductive and electrical insulating polymer composites[J]. Composites Communications, 2018(8): 74-82.

李俊杰,梅云辉,梁玉,等.功率器件高电压封装用复合电介质灌封材料研究[J].电工技术学报,2022,37(3):786-792.

LI Junjie,MEI Yunhui,LIANG Yu,et al.Study on composite dielectric encapsulation materials for high voltage power device packaging[J]. Transactions of China Electrotechnical Society, 2022,37(3):786-792.

李可为.集成电路芯片封装技术[M].北京:电子工业出版社, 2007.

LI Kewei.Integrated circuit chip packaging technology[M]. Beijing:Publishing House of Electronics Industry,2007.

HU Min, YU Demei, WEI Jianbo.Thermal conductivity determination of small polymer samples by differential scanning calorimetry[J]. Polymer Testing, 2007, 26(3): 333-337.

谢伟,杨征,程显,等.环氧树脂材料热氧老化特性研究[J].电工技术学报,2020,35(20):4397-4404.

XIE Wei,YANG Zheng,CHENG Xian,et al.Study on thermo-oxygen aging characteristics of epoxy resin material[J]. Transactions of China Electrotechnical Society,2020,35(20):4397-4404.

汪朝宇,郝智,申腙,等.填料填充型聚合物基导热材料的研究进展[J].高分子通报,2022(1):18-23.

WANG Chaoyu,HAO Zhi,SHEN Zong,et al.Research progress of filler-filled polymer-based thermal conductive materials[J]. Chinese Polymer Bulletin,2022(1):18-23.

CHEN Guangliang, CHEN Dongliang, HUANG Jun, et al. Focused plasma- and pure water-enabled, electrode-emerged nanointerfaced nico hydroxide-oxide for robust overall water splitting[J]. ACS Applied Materials & Interfaces, 2021, 13(38): 45566-45577.

LYU Fangcheng, RUAN Haoou, SONG Jingxuan, et al.Enhanced surface insulation and depressed dielectric constant for Al 2 O 3 epoxy composites through plasma fluorination of filler[J ] . Journal of Physics D: Applied Physics, 2019, 52(15): 155201.

胡多,任成燕,章程,等.等离子体射流处理对聚全氟乙丙烯薄膜沿面绝缘特性的影响研究[J].中国电机工程学报, 2019,39(15):4633-4640.

HU Duo,REN Chengyan,ZHANG Cheng,et al.Effect of deposited film on the surface insulation characteristics of FEP material by atmospheric pressure plasma jet[J]. Proceedings of the CSEE, 2019,39(15):4633-4640.

KONG Fei, ZHAO Mingming, ZHANG Cheng, et al.Two-phase-interfaced, graded-permittivity titania electrical insulation by atmospheric pressure plasmas[J]. ACS Applied Materials & Interfaces, 2022, 14(1): 1900-1909.

吉建伟,山村和也,邓辉.面向单晶SiC原子级表面制造的等离子体辅助抛光技术[J].物理学报,2021,70(6):68-80.

JI Jianwei,SHAN Cun heye,DENG Hui.Plasma-assisted polishing for atomic surface fabrication of single crystal SiC[J]. Acta Physica Sinica,2021,70(6):68-80.

邵涛,严萍.大气压气体放电及其等离子体应用[M].北京:科学出版社,2015.

SHAO Tao,YAN Ping.Atmospheric pressure gas discharge and its plasma applications[M]. Beijing:Science Press,2015.

KONG Fei, ZHANG Penghao, YU Weixin, et al.Enhanced surface insulating performance for polystyrene by atmospheric pressure plasma jet deposition[J]. Applied Surface Science, 2020(527): 146826.

SHANKER A, LI C, KIM G H, et al.High thermal conductivity in electrostatically engineered amorphous polymers[J]. Science Advances, 2017, 3(7): e1700342.

XU Yanfei, WANG Xiaoxue, ZHOU Jiawei, et al. Molecular engineered conjugated polymer with high thermal conductivity[J]. Science Advances, 2018, 4(3): eaar3031.

SHEN Sheng, HENRY A, TONG J, et al.Polyethylene nanofibres with very high thermal conductivities[J]. Nature Nanotechnology, 2010, 5(4): 251-255.

HE Xuhua, WANG Yuechuan.Recent advances in the rational design of thermal conductive polymer composites[J]. Industrial & En gineering Chemistry Research, 2021, 60(3): 1137-1154.

SHEN Xi, ZHENG Qingbin, KIM J K.Rational design of twodimensional nanofillers for polymer nanocomposites toward multifunctional applications[J]. Progress in Materials Science, 2021 (115): 100708.

CUI Wei, DU Feipeng, ZHAO Jinchao, et al.Improving thermal conductivity while retaining high electrical resistivity of epoxy composites by incorporating silica-coated multi-walled Carbon nanotubes[J]. Carbon, 2011, 49(2): 495-500.

AHN K, KIM K, KIM J.Thermal conductivity and electric properties of epoxy composites filled with TiO 2 -coated copper nanowire[J ] . Polyme r, 2015(76): 313-320.

YUAN Hao, WANG Yang, LI Ting, et al.Highly thermal conductive and electrically insulating polymer composites based on polydopamine-coated copper nanowire[J]. Composites Science and Technology, 2018(164): 153-159.

BURGER N, LAACHACHI A, FERRIOL M, et al.Review of thermal conductivity in composites: Mechanisms, parameters and theory[J]. Progress in Polymer Science, 2016(61): 1-28.

翟鹏飞,彭玉峰,韩雪云.不同温度和压强下甲基乙烯基硅橡胶聚合物的分子动力学模拟研究[J].电瓷避雷器,2021(2):212-218.

ZHAI Pengfei,PENG Yufeng,HAN Xueyun.Molecular dynamics simulation of methyl vinyl silicone rubber polymer at different temperatures and pressures[J]. Insulators and Surge Arresters,2021 (2):212-218.

YORIFUJI D S, ANDO S. Molecular structure dependence of out-ofplane thermal diffusivities in polyimide films: A key parameter for estimating thermal conductivity of polymers[J]. Macromolecules, 2010, 43(18): 7583-7593.

SANTOSW N D, MUMMERYP, WALLWORK A.Thermal diffusivity of polymers by the laser flash technique[J]. Polymer Testing, 2005, 24(5): 628-634.

HA S M, KWON O H, OH Y G, et al. Thermally conductive polyamide 6/carbon filler composites based on a hybrid filler system[J]. Science and Technology of Advanced Materials, 2015, 16(6): 065001.

刘科科.高导热绝缘环氧树脂基复合材料的制备及其性能研究[D].南京:南京航空航天大学,2013.

LIU Keke. Preparation and properties of highly thermally conductive and insulating epoxy resin-based composites[D]. Nanjing:Nanjing University of Aeronautics and Astronautics,2013.

肖琰,魏伯荣,杨海涛,等.导热高分子材料的研究开发现状[J].中国塑料,2005,19(4):12-16.

XIAO Yan,WEI Bairong,YANG Haitao,et al.Research and applications of thermally conductive polymers[J]. China Plastics, 2005,19(4):12-16.

肖超.三维导热网络的构筑及其环氧树脂复合材料性能研究[D].合肥:中国科学技术大学,2020.

XIAO Chao. Construction of three-dimensional thermal conductivity network and its performance of epoxy resin composites[D]. Hefei:University of Science and Technology of China,2020.

SHTEIN M, NADIV R, BUZAGLO M, et al.Thermally conductive graphene-polymer composites: Size, percolation, and synergy effects[J]. Chemistry of Materials, 2015, 27(6): 2100-2106.

HUANG Congliang, QIAN Xin, YANG Ronggui.Thermal conductivity of polymers and polymer nanocomposites[J]. Materials Science and Engineering R: Reports, 2018(132): 1-22.

YUAN Zhenye, MA Haoqi, HUSSIEN M A, et al.Development and challenges of thermal interface materials:A review[J]. Macromolecular Materials and Engineering, 2021, 306(11): 2100428.

KIM H S, JANG J, LEE H, et al.Thermal management in polymer composites:A review of physical and structural parameters[J]. Advanced Engineering Materials, 2018, 20(10): 1800204.

GUO Baochun, TANG Zhenghai, ZHANG Liqun.Transport performance in novel elastomer nanocomposites: Mechanism, design and control[J]. Progress in Polymer Science, 2016(61): 29-66.

YUNG K C, LIEM H.Enhanced thermal conductivity of Boron nitride epoxy-matrix composite through multi-modal particle size mixing[J]. Journal of Applied Polymer Science, 2007, 106(6): 3587-3591.

ZHANG Yuanan, GAO Wei, LI Yujing, et al. Hybrid fillers of hexagonal and cubic boron nitride in epoxy composites for thermal management applications[J]. RSC Advances, 2019, 9(13): 7388-7399.

SHTEIN M, NADIV R, BUZAGLO M, et al.Graphene-based hybrid composites for efficient thermal management of electronic devices[J]. ACS Applied Materials & Interfaces, 2015, 7(42): 23725-23730.

HUXTABLE S T, CAHILL D G, SHENOGIN S, et al.Interfacial heat flow in carbon nanotube suspensions[J]. Nature Materials, 2003, 2(11): 731-734.

SHENOGIN S, XUE L P, OZISIK R, et al.Role of thermal boundary resistance on the heat flow in carbon - nanotube composites[J]. Journal of Applied Physics, 2004, 95(12): 8136-8144.

LIU Yuan, HUANG Yu, DUAN Xiangfeng.Van der waals integration before and beyond two-dimensional materials[J]. Nature, 2019, 567(7748): 323-333.

KIM G H, LEE D, SHANKER A, et al.High thermal conductivity in amorphous polymer blends by engineered interchain interactions[J]. Nature Materials, 2015, 14(3): 295-300.

SHEN Xi, WANG Zhenyu, WU Ying, et al.Affect of functionalization on thermal conductivities of graphene/epoxy composites[J]. Carbon, 2016(108): 412-422.

LIU Biao, YANG Minhao, ZHOU Wenying, et al.High energy density and discharge efficiency polypropylene nanocomposites for potential high-power capacitor[J]. Energy Storage Materials, 2020 (27): 443-452.

ROY A, BOUGHER T L, GENG Rugang, et al.Thermal conductance of poly(3-methylthiophene) brushes[J]. ACS Applied Materials & Interfaces, 2016, 8(38): 25578-25585.

ANDRITSCH T, FABIANI D, VAZQUEZ I R.Nanodielectrics-examples of preparation and microstructure[J]. IEEE Electrical Insulation Magazine, 2013, 29(6): 21-28.

ZHANG Kun, LU Yi, HAO Ningke, et al.Enhanced thermal conductivity of cellulose nanofibril/aluminum nitride hybrid films by surface modification of Aluminum nitride[J]. Cellulose, 2019, 26 (16): 8669-8683.

WANG Rui, XIE Congzhen, GOU Bin, et al.Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology[J]. Polymer Testing, 2020(89): 106574.

CHEN Jin, HUANG Xingyi, ZHU Yingke, et al.Cellulose nanofiber supported 3D interconnected BN nanosheets for epoxy nanocomposites with ultrahigh thermal management capability[J]. Advanced Functional Materials, 2017, 27(5): 1604754.

ZENG Xiaoliang, SUN Jiajia, YAO Yimin, et al.A combination of Boron nitride nanotubes and cellulose nanofibers for the preparation of a nanocomposite with high thermal conductivity[J]. ACS Nano, 2017, 11(5): 5167-5178.

WU Kai, LEI Chuxin, HUANG Rui, et al.Design and preparation of a unique segregated double network with excellent thermal conductive property[J]. ACS Applied Materials & Interfaces, 2017, 9(8): 7637-7647.

邱介山.低温等离子体技术在炭材料改性方面的应用[J].新型炭材料,2001,16(3):58-63.

QIU Jieshan.Application of low temperature plasma in surface treatment of carbon materials[J]. New Carbon Materials,2001,16 (3):58-63.

ZHANG Chen, WANG Ruixue, SHAO Tao, et al. Atmosphericpressure pulsed discharges and plasmas:mechanism, characteristics and applications[J]. High Voltage, 2016, 3(1): 14-20.

INAGAKI N, TASAKA S, ISHII K.Surface modification of polyethylene and magnetite powders by combination of fluidization and plasma polymerization[J]. Journal of Applied Polymer Science, 1993, 48(8): 1433-1440.

SABATA A, VAN OOIJ W J, YASUDA H K.Plasma-polymerized films of trimethylsilane deposited on cold-rolled steel substrates. part 1: Characterization by XPS, AES and TOF-SIMS[J]. Surface and Interface Analysis, 1993, 20(10): 845-859.

DIMITRIOU A, HALE M D, SPEAR M J.The effect of four methods of surface activation for improved adhesion of wood polymer composites (WPCs)[J]. International Journal of Adhesion and Adhesives, 2016(68): 188-194.

CHEN Weimin, ZHOU Xiaoyan, ZHANG Xiaotao, et al. Fast enhancement on hydrophobicity of poplar wood surface using lowpressure dielectric barrier discharges (DBD) plasma[J]. Applied Surface Science, 2017(407): 412-417.

米彦,苟家喜,刘露露,等.脉冲介质阻挡放电等离子体改性对BN/EP复合材料击穿强度和热导率的影响[J].电工技术学报,2020,35(18):3949-3959.

MI Yan,GOU Jiaxi,LIU Lulu,et al. Effect of pulse dielectric barrier discharge plasma modification on breakdown strength and thermal conductivity of BN/EP composites[J]. Transactions of China Electrotechnical Society,2020,35(18):3949-3959.

温贵安.无机粉体的低温等离子体改性[J].材料导报,1999, 13(2):40-42.

WEN Guian.Low-temperature plasma modification of inorganic powders[J]. Materials Guide,1999,13(2):40-42.

马云飞,章程,李传扬,等.重频脉冲放电等离子体处理聚合物材料加快表面电荷消散的实验研究[J].中国电机工程学报, 2016,36(6):1731-1738.

MA Yunfei,ZHANG Cheng,LI Chuanyang,et al.Experimental study on accelerated surface charge dissipation by heavy frequency pulsed discharge plasma treatment of polymer materials[J]. Proceedings of the CSEE,2016,36(6):1731-1738.

杨国清,刘阳,戚相成,等.低气压介质阻挡放电条件下纳米SiO 2 表面氟化研究[J ] .高电压技术,2021,47(9):3144-3152.

YANG Guoqing,LIU Yang,QI Xiangcheng,et al.Research on surface fluorination of nanosilica by dielectric barrier discharge under low pressure[J]. High Voltage Engineering,2021,47(9):3144-3152.

杨国清,戚相成,高青青,等.等离子体氟化协同偶联剂改性纳米SiO 2 /环氧树脂电气性能[J ] .高电压技术,2022,48(2):689-697.

YANG Guoqing,QI Xiangcheng,GAO Qingqing,et al. Electrical properties of nanosilica/epoxy resin modified by cooperation of plasma fluorination and coupling agent[J]. High Voltage Engineering,2022,48(2):689-697.

NICHOLS H L, ZHANG Ning, ZHANG Jing, et al.Coating nanothickness degradable films on nanocrystalline hydroxyapatite particles to improve the bonding strength between nanohydroxyapatite and degradable polymer matrix[J]. Journal of Biomedical Materials Research Part A, 2007, 82(2): 373-382.

MATHEW G, HUH M Y, RHEE J M, et al.Improvement of properties of silica-filled styrene-butadiene rubber composites through plasma surface modification of silica[J]. Polymers for Advanced Technologies, 2004, 15(7): 400-408.

KIM H Y, YASUDA H K.Improvement of fatigue properties of poly (methyl-methacrylate)bone cement by means of plasma surface treatment of fillers[J]. Journal of Biomedical Materials Research Part B-Applied Biomaterials, 1999, 48(2): 135-142.

SHI Donglu, WANG S X, VAN OOIJ W J, et al.Uniform deposition of ultrathin polymer films on the surfaces of Al 2 O 3 nanoparticles by a plasma treatment[J ] . Applied Physics Letters, 2001, 78(9): 1243-1245.

YAN Wei, PHUNG B T, HAN Zhaojun, et al. Plasma polymercoated on nanoparticles to improve dielectric and electrical insulation properties of nanocomposites[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2014, 21(2): 548-555.

YAN W, HAN Z J, PHUNG B T, et al.Silica nanoparticles treated by cold atmospheric - pressure plasmas improve the dielectric performance of organic-inorganic nanocomposites[J]. ACS Applied Materials & Interfaces, 2012, 4(5): 2637-2642.

TUO J I , ZHANG L Q, WANG W C, et al.Cold plasma modification of boron nitride fillers and its effect on the thermal conductivi ty of silicone rubber/boron nitride composites[J]. Polymer Composites, 2012, 33(9): 1473-1481.

吴旭辉,吴广宁,杨雁,等.等离子体改性纳米粒子对聚酰亚胺复合薄膜陷阱特性影响[J].中国电机工程学报,2018,38(11):3410-3418.

WU Xuhui,WU Guangning,YANG Yan,et al. Influence of nanoparticle plasma modification on trap properties of polyimide composite films[J]. Proceedings of the CSEE,2018,38(11):3410-3418.

吴旭辉,吴广宁,杨雁,等.等离子体改性纳米粒子对聚酰亚胺复合薄膜耐电晕性能的影响[J].高电压技术,2017,43(9):2881-2888.

WU Xuhui,WU Guangning,YANG Yan,et al.Effect of nanoparticles plasma treatment on corona resistance of polyimide composite films[J]. High Voltage Engineering,2017,43(9):2881-2888.

MI Yan, GOU Jiaxi, LIU Lulu, et al.Enhanced breakdown strength and thermal conductivity of BN/EP nanocomposites with bipolar nanosecond pulse DBD plasma modified BNNSs[J]. Nanomaterials, 2019, 9(10): 1396.

BALAJI P S, CHEN Zhiqiang, HUA Lilu, et al.Fabrication of boron nitride nanotube-gold nanoparticle hybrids using pulsed plasma in liquid[J]. Langmuir, 2014, 30(35): 10712-10720.

ITO M , HAYAKAWA M , TAKASHIMA S, et al.Preparation of aqueous dispersion of titanium dioxide nanoparticles using plasma on liquid surface[J]. Japanese Journal of Applied Physics, 2012, 51 (11R): 116201.

SHIRAFUJI T, NOGUCHI Y, YAMAMOTO T, et al.Functionalization of multiwalled carbon nanotubes by solution plasma processing in ammonia aqueous solution and preparation of composite material with polyamide 6[J]. Japanese Journal of Applied Physics, 2013, 52(12R): 125101.

IMASAKA K, KATO Y, SUEHIRO J.Enhancement of microplasmabased water-solubilization of single-walled carbon nanotubes using gas bubbling in water[J]. Nanotechnology, 2007, 18(33): 335602.

OKA Y, OHNISHI K, ASAMI K, et al. Dispersion of carbon nanotubes into water without dispersant using cavitation bubble plasma[J]. Vacuum, 2017(136): 209-213.

INOUE K, GOTO T, ITO T, et al. Boron nitride with high zeta potential via plasma processing in solution for preparation of polyrotaxane composite[J]. Journal of Physics D: Applied Physics, 2021, 54(42): 425202.

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

爆炸性环境分断放电的建弧过程研究

发射光谱法诊断空气电弧的稳态电子密度分布

触发真空开关中初始等离子体的产生和扩展

放电等离子体反应器装置及其电场分析评述

介质阻挡放电的电荷传输特性研究