铜基电触头石墨烯改性复合材料导热性能优化设计

王梦溪; 韩智云; 李俊科; 任瀚文; 李庆民; 丁一

doi:10.13296/j.1001-1609.hva.2026.07.017

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铜基电触头石墨烯改性复合材料导热性能优化设计

研究与分析 | 更新时间：2026-07-06

- 铜基电触头石墨烯改性复合材料导热性能优化设计
- Optimization Design for Thermal Conductivity of Graphene-modified Copper-based Electrical Contact Composite Materials
- 高压电器 2026年62卷第7期页码：166-174
- 作者机构：
  
  华北电力大学新能源电力系统国家重点实验室，北京 102206
  国网智能电网研究院有限公司，北京 102200
- 作者简介：
  
  王梦溪（2000—），女，硕士研究生，主要从事断路器高性能触头材料设计方面的研究工作（E-mail:wmx_ncepu@163.com）。
  李庆民（1968—），男，博士研究生，教授，博士生导师，主要从事高电压与绝缘技术、放电物理方面的研究工作（通信作者）（E-mail:lqmeee@nc epu.edu.cn）。
- 基金信息：
  
  北京市自然科学基金;Beijing Natural Science Foundation(3232053);国家自然科学基金项目;National Natural Science Foundation of China(51929701;52207153;92266109)
- DOI：10.13296/j.1001-1609.hva.2026.07.017
  中图分类号：
- 收稿：2025-12-03，
  
  修回：2026-02-25，
  
  纸质出版：2026-07-16
- 稿件说明：
移动端阅览
王梦溪, 韩智云, 李俊科, 等. 铜基电触头石墨烯改性复合材料导热性能优化设计[J]. 高压电器, 2026,62(7):166-174.

WANG Mengxi, HAN Zhiyun, LI Junke, et al. Optimization Design for Thermal Conductivity of Graphene-modified Copper-based Electrical Contact Composite Materials[J]. High Voltage Apparatus, 2026, 62(7): 166-174.
王梦溪, 韩智云, 李俊科, 等. 铜基电触头石墨烯改性复合材料导热性能优化设计[J]. 高压电器, 2026,62(7):166-174. DOI： 10.13296/j.1001-1609.hva.2026.07.017.

WANG Mengxi, HAN Zhiyun, LI Junke, et al. Optimization Design for Thermal Conductivity of Graphene-modified Copper-based Electrical Contact Composite Materials[J]. High Voltage Apparatus, 2026, 62(7): 166-174. DOI： 10.13296/j.1001-1609.hva.2026.07.017.

摘要

随着中国新能源电力系统向更高电压等级、大容量化方向发展，断路器触头的服役性能受到了严峻的挑战，其关键在于高能电弧所产生的热量积聚引起的表面烧蚀，因此亟需设计高导热铜基复合材料以提高触头的抗烧蚀性能。石墨烯因其热性能突出被广泛应用于提升金属基复合材料的导热性能，为此文中构建了不同石墨烯排列取向、尺寸以及层数的复合分子模型，探究了温度和石墨烯掺杂结构参数对复合材料热导率的影响，分析了石墨烯对复合材料导热性能的微观增强机制，优化设计了更高抗烧蚀性能铜基复合材料并通过实验进行了验证。结果表明：石墨烯复合材料的热导率与温度成反比，但均高于纯铜基体热导率；石墨烯排列取向与热流方向夹角处于0°～8.19°之间时能有效提高复合材料热导率；复合材料热导率随石墨烯尺寸、层数增大而增大，掺杂排列角度为0°、尺寸为378.84 Å的5层石墨烯时，复合材料的热导率提升最为显著，较纯铜模型提高了72.7%。文中可为工程上高性能铜基复合材料的优化设计提供理论指导与技术支撑。

Abstract

With the development of China's new energy power system toward higher voltage levels and larger capacities

the service performance of circuit breaker contacts faces severe challenges.The key problem is the surface ablation caused by heat accumulation generated by high-energy arcs. It is therefore necessary to design high thermal conductivity copper-based composite materials to enhance the ablation resistance of the contacts. Graphene is widely used to improve the thermal conductivity of metal matrix composites owning to its exceptional thermal properties. Accordingly

in this study a composite molecular model featuring various graphene arrangement orientations

dimensions and layer counts is set up. The influence of temperature and graphene dopping structural parameters on the thermal conductivity of composites is explored

the microscopic enhancement mechanism of graphene on the thermal conductivity of composites is analyzed

and the copper-based composites with higher ablation resistance are optimally designed and experimentally verified. The results show that the thermal conductivity of graphene composites is inversely proportional to temperature

but both are higher than those of pure copper matrix. When the included angle between the orientation of graphene arrangement and the direction of heat flow is between 0°～8.19°

the thermal conductivity of the composite can be effectively improved.The thermal conductivity of the composite is increased with the increase of graphene dimension and number of layers and

when the dopping arrangement angle is 0°and the dimension of 5 layers of graphene is 378.84Å

the thermal conductivity improvement of the composite is remarkable

which is 72.7% higher than that of the pure copper model. This paper can provide theoretical guidance and technical support for the optimal design of high-performance copper-based composites in engineering.

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