550 kV GIL弹簧触指结构的多物理场耦合分析与优化设计

吴芊婳; 杨昊; 周福升; 高超; 丁瑞芳; 赵杨震

doi:10.13296/j.1001-1609.hva.2026.09.008

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550 kV GIL弹簧触指结构的多物理场耦合分析与优化设计

高压开关与GIS/GIL设备技术 | 更新时间：2026-09-10

- 550 kV GIL弹簧触指结构的多物理场耦合分析与优化设计
- Multi-physics Field Coupling Analysis and Optimal Design of Spring Finger Structure in 550 kV GIL
- 高压电器 2026年62卷第9期页码：69-78
- 作者机构：
  
  西安工程大学电子信息学院，西安 710600
  南方电网科学研究院有限责任公司，广州 510663
- 作者简介：
  
  吴芊婳（2001—），女，硕士，主要研究方向为高电压绝缘技术（E-mail：3137536179@qq.com）。
  杨昊（1988—），男，博士，副教授，主要研究方向为高电压绝缘技术（通信作者）（E-mail：yanghao@xpu.edu.cn）。
- 基金信息：
  
  国家自然科学基金资助项目。Project Supported by National Nature Science Foundation of China.(52007138)
- DOI：10.13296/j.1001-1609.hva.2026.09.008
  中图分类号：
- 收稿：2026-03-21，
  
  修回：2026-05-22，
  
  纸质出版：2026-09-16
- 稿件说明：
移动端阅览
吴芊婳, 杨昊, 周福升, 等. 550 kV GIL弹簧触指结构的多物理场耦合分析与优化设计[J]. 高压电器, 2026,62(9):69-78.

WU Qianhua, YANG Hao, ZHOU Fusheng, et al. Multi-physics Field Coupling Analysis and Optimal Design of Spring Finger Structure in 550 kV GIL[J]. High Voltage Apparatus, 2026, 62(9): 69-78.
吴芊婳, 杨昊, 周福升, 等. 550 kV GIL弹簧触指结构的多物理场耦合分析与优化设计[J]. 高压电器, 2026,62(9):69-78. DOI： 10.13296/j.1001-1609.hva.2026.09.008.

WU Qianhua, YANG Hao, ZHOU Fusheng, et al. Multi-physics Field Coupling Analysis and Optimal Design of Spring Finger Structure in 550 kV GIL[J]. High Voltage Apparatus, 2026, 62(9): 69-78. DOI： 10.13296/j.1001-1609.hva.2026.09.008.

摘要

弹簧触指作为高压电气设备中的关键电连接部件，其性能直接影响设备安全性和可靠性。文中探究了簧丝直径、弹簧圈数和触头座尖角槽角度对弹簧触指性能的影响，发现簧丝直径和尖角沟槽角度对触指电接触性能影响显著。增大簧丝直径可降低接触电阻和电流密度，但可能导致局部过热；增大尖角沟槽角度可降低接触电阻和接触温升，但可能导致电流密度过高。为获得最佳性能，文中采用NSGA-II遗传算法进行优化，以最小化接触温升为目标，优化结果表明，簧丝直径1.5 mm，弹簧圈数135圈，尖角沟槽角度135°时，触指性能最优。文中揭示了弹簧触指结构参数对电接触性能的影响规律，并提出了基于多目标遗传算法的优化方法，为GIL触指结构设计及热故障分析提供了理论依据。

Abstract

Spring contact finger is critical electrical connecting element in high-voltage electrical equipment

and its performance directly affects the safety and reliability of the equipment. In this paper

the effects of wire diameter

number of spring coils

and the groove angle of the contact base on the performnce of the spring contact finger are investigated

finding that the wire diameter and the groove angle have a significant influence on the electrical contact performance of the contact finger. Increasing the wire diameter can reduce the contct resistance and current density

but may lead to localized overheating. Increasing the groove angle can reduce the contact resistance and contact temperature rise

but may result in excessively high current density. To achieve optimal performance

in this paper the NSGA-II multi-objective genetic algorithm is employed for optimization

with the minimal contact temperature rise as the objective The optimization results show that the optimal performance of the contact finger is achieved when the wire diameter is 1.5 mm

the number of spring coil is 135 and the groove angle is 135°. This study reveals the influence of tructural parameters of the spring contct finger on the electrical contact performance and proposes an optimization method based on a multi-objective genetic algorithm

providing a theoretical basis for GIL contact finger structural design and thermal fault analysis.

关键词

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