基于液相烧结耦合熔渗补铜制备CuCr合金均质性及性能调控

孟晨; 韩金儒

doi:10.13296/j.1001-1609.hva.2025.11.018

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基于液相烧结耦合熔渗补铜制备CuCr合金均质性及性能调控

研究与分析 | 更新时间：2025-11-04

- 基于液相烧结耦合熔渗补铜制备CuCr合金均质性及性能调控
- Homogeneity and Property Regulation of CuCr Alloy Based on Liquid-phase Sintering Coupled with Copper Infiltration
- 高压电器 2025年61卷第11期页码：196-202
- 作者机构：
- 作者简介：
  
  孟晨（1970—），男，高级工程师，主要从事高压开关相关工作（E-mail：31067704@qq.com）。
  韩金儒（1994—），男，工程师，主要从事触头材料的研发工程（通信作者）（E-mail：xupinhanhao@163.com）。
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2025.11.018
  中图分类号：
- 收稿：2025-05-20，
  
  修回：2025-08-25，
  
  纸质出版：2025-11-16
- 稿件说明：
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孟晨, 韩金儒. 基于液相烧结耦合熔渗补铜制备CuCr合金均质性及性能调控[J]. 高压电器, 2025,61(11):196-202.

MENG Chen, HAN Jinru. Homogeneity and Property Regulation of CuCr Alloy Based on Liquid-phase Sintering Coupled with Copper Infiltration[J]. High voltage apparatus, 2025, 61(11): 196-202.
孟晨, 韩金儒. 基于液相烧结耦合熔渗补铜制备CuCr合金均质性及性能调控[J]. 高压电器, 2025,61(11):196-202. DOI： 10.13296/j.1001-1609.hva.2025.11.018.

MENG Chen, HAN Jinru. Homogeneity and Property Regulation of CuCr Alloy Based on Liquid-phase Sintering Coupled with Copper Infiltration[J]. High voltage apparatus, 2025, 61(11): 196-202. DOI： 10.13296/j.1001-1609.hva.2025.11.018.

摘要

CuCr合金已经成为环保型真空开关领域首选的触头材料，而研究和开发高效的高性能均质CuCr合金制备技术是目前研究的热点和难题。文中将液相烧结和熔渗补铜的概念耦合来制备均质的CuCr合金，并采用固溶及时效对其进行二次处理，观察CuCr合金微观组织和性能的演变。研究发现：通过液相烧结耦合熔渗补铜的工艺，能够稳定制备均质的CuCr50合金，CuCr50合金边缘、中部和芯部富Cr相的平均粒径分别为48.35、45.60、47.96 μm，富Cr相粒径的标准偏差在42.04～44.78 μm，进一步验证微观组织的均匀性。经过热处理（固溶+时效）处理后，CuCr合金的电导率由18.72～19.09 MS·m

-1

增加至22.6～22.93 MS·m

-1

，提高了20.1%～20.8%，抗拉强度由308.76 MPa增加至385.91 MPa，增加了25.0%，这是由于热处理后，富Cu相中固溶的Cr质量分数降低，这些析出相能够以纳米球状的形式存在于合金中，起到弥散强化的作用，一方面改善了合金的电导率，另一方面析出相阻碍位错滑移，从而显著提高了材料的力学性能。

Abstract

CuCr alloys have become the preferred contact materials in the field of environmentally friendly vacuum switches，and the research and development of efficient and high-performance homogeneous CuCr alloy preparation technology are at present a hotspot and a difficult problem in the research. In this paper the concepts of liquid phase sintering and copper infiltration are combined to prepare homogeneous CuCr alloys，and the solid solution and aging are used for secondary treatment so to observe the evolution of the microstructure and properties of CuCr alloys. It is found by the research that the homogeneous CuCr50 alloy can be stably prepared by the process of liquid-phase sintering coupled with infiltration of complementary copper，and the average particle sizes of the Cr-rich phase at the edge，middle and core of CuCr50 alloy are 48.35 μm，45.60 μm and 47.96 μm，respectively，the standard deviations of the Cr-rich phase particle sizes are in the range of 42.04-44.78 μm，and the homogeneity of microstructure after heat treatment（solid solution + aging）is verified further.The conductivity of the CuCr alloy is increased from 18.72-19.09 MS·m

-1

to 22.62-22.93 MS·m

-1

，with an increase rate of 20.1% to 20.8%，and the tensile strength is increased from 308.76 MPa to 385.91 MPa，with an increase rate of 25.0%，which is attributed to the reduction of the solid-solution Cr content in the Cu-rich phase after heat treatment.These precipitated phases can exist in the alloy in the form of nanorods with function of diffusion strengthening which，on the one hand，improves the electrical conductivity of the alloy and，on the other hand，the precipitated phases impedes the dislocation slip，thus significantly improving the mechanical properties of the material.

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references

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