In view of heat dissipation in the design of 150 kW high-power-density electronic DC transformer power module

the principle of heat loss of high-frequency conductor is studied. The temperature rise is calculated by electromagnetic thermal coupling simulation. The conductor structure is improved from the mechanism of eddy current loss

the effectiveness of reducing heat loss is analyzed by simulation

and the temperature rise of conductor and module structure is reduced to less than 30.5 K. The parameters of fin of the aluminum base radiator in the module of high voltage side is optimized

but the temperature rise of the IGBT & SiC is still too high. The new and high efficiency radiator is developed in combination with the vapor chamber soaking technology. It is verified from the theoretical analysis of thermal resistance and temperature rise simulation that the thermal conductivity of the vapor chamber reaches 4 000 W/(m·K)

and the temperature rise of the power element is reduced to 31.9 K. Finally

the test platform is set up and the temperature rise of the developed power module prototype is operated at rated power. It is measured that the power density of the module reaches 1.92 kW/L and the important elements meet the temperature rise target

thus the reliability of the power electronic modules

at the time of compact integration

is also assured at the same time.