Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification

YAN Jingyi; ZHANG Chuansheng; KONG Fei; WANG Kun; YANG Wei; CHENG Xian; SHAO Tao

doi:10.13296/j.1001-1609.hva.2026.03.021

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Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification

Research & Analysis | 更新时间：2026-03-11

- Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification
- High Voltage Apparatus Vol. 62, Issue 3, Pages: 171-182(2026)
- 作者机构：
  
  郑州大学电气与信息工程学院，郑州 450001
  中国科学院电工研究所等离子体科学和能源转化北京市国际科技合作基地，北京 100190
  中国科学院大学，北京 100190
  国网智能电网研究院有限公司，北京 102209
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2026.03.021
  CLC：
- Received：18 July 2025，
  
  Revised：2025-09-19，
  
  Published：16 March 2026
- 稿件说明：
移动端阅览
YAN Jingyi, ZHANG Chuansheng, KONG Fei, et al. Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification[J]. High Voltage Apparatus, 2026, 62(3): 171-182.
DOI：

YAN Jingyi, ZHANG Chuansheng, KONG Fei, et al. Research Progress on Preparation of High Thermal Conductivity Composite Insulating Materials:Plasma Surface Modification[J]. High Voltage Apparatus, 2026, 62(3): 171-182. DOI： 10.13296/j.1001-1609.hva.2026.03.021.

摘要

高性能绝缘材料应用广泛，在电气、电子等领域不可或缺。特别是，随着高压电工装备、微电子产品的迅猛发展，传统的绝缘材料难以满足趋于高度集成化发展的器件因单位功率密度显著提高而产生的散热需求，器件的稳定性以及寿命受到严重的影响。在高电压绝缘材料领域中，近年来高分子聚合物因其良好的电气绝缘性能被广泛关注，但其极低的导热性能限制了其在高散热场合下的应用，因此亟待开发高导热绝缘材料。文中首先综述了本征型和填充型复合绝缘材料的制备方法，其中填充型制备是现阶段常用的方案。在该方案中，界面热阻是限制导热性能得到良好提升的瓶颈问题。针对这一问题，相关学者对填料进行表面修饰，以增加填料与聚合物的界面相容性。据此文中全面总结现阶段常用的填料表面修饰方法，并着重对等离子体修饰的机理以及处理方式进行介绍。等离子体表面修饰是制备高导热复合材料的一种新途径和新思路，与现有工艺相结合，未来有望推动其工业化应用。

Abstract

High-performance insulation materials have wide application and are indispensable in electrical and electronic fields. In particular

with the rapid development of high voltage electrical equipment and microelectronic products

traditional insulation materials are hard to meet the heat dissipation requirements of devices that are evolving towards higher integration due to the significant increase in unit power density

and the stability and lifetime of devices are seriously affected. In the field of high voltage insulating materials

polymers are focused recently for their perfect electrical insulation properties. However

its extremely low thermal conductivity limits its application in high heat dissipation scenarios. Consequently

it is urgent to develop high thermal conductivity insulating materials. In this paper the preparation methods of intrinsic and filled composite insulating materials are comprehensively described

in which the lattern scheme is at present stage the commonly used scheme. In the scheme

the interfacial thermal resistance is the key issue that limits the improvement of thermal conductivity. Regarding this issue

surface modification of the filler is performed by relevant researchers to increase the interfacial compatibility between the filler and the polymer. On this basis

in this paper surface modification methods for fillers which are commonly used at presetn stage are comprehensively summarized

and the mechanism of plasma modification and the modification process are introduced in particular. Plasma surface modification is a new approach and idea for the preparation of high thermal conductivity composites wich

combined with existing processes

is expected to promote industrial applications in the future.

关键词

Keywords

references

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