Research Progress on Formation Mechanisms of Latent Defects and Non-destructive Testing Techniques for GIS/GIL Insulators

HE Chun; HE Jin; ZHAO Siyuan; YANG Zhichao; CHEN Yun; DUAN Xiaohui; DUAN Qichao; WANG Ning; XIA Hui; LI Jin

doi:10.13296/j.1001-1609.hva.2026.09.001

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Research Progress on Formation Mechanisms of Latent Defects and Non-destructive Testing Techniques for GIS/GIL Insulators

High-voltage Switchgear and GIS/GIL Technology | 更新时间：2026-09-10

- Research Progress on Formation Mechanisms of Latent Defects and Non-destructive Testing Techniques for GIS/GIL Insulators
- High Voltage Apparatus Vol. 62, Issue 9, Pages: 1-14,32(2026)
- 作者机构：
  
  国网天津市电力公司，天津 300010
  中国电力科学研究院有限公司，北京 100192
  河南平高电气股份有限公司，河南平顶山 467000
  中国科学研究院电工研究所，北京 100190
  天津大学智能配用电装备与系统全国重点实验室，天津 300072
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2026.09.001
  CLC：
- Received：12 April 2026，
  
  Revised：2026-05-21，
  
  Published：16 September 2026
- 稿件说明：
移动端阅览
HE Chun, HE Jin, ZHAO Siyuan, et al. Research Progress on Formation Mechanisms of Latent Defects and Non-destructive Testing Techniques for GIS/GIL Insulators[J]. High Voltage Apparatus, 2026, 62(9): 1-14,32.
DOI：

HE Chun, HE Jin, ZHAO Siyuan, et al. Research Progress on Formation Mechanisms of Latent Defects and Non-destructive Testing Techniques for GIS/GIL Insulators[J]. High Voltage Apparatus, 2026, 62(9): 1-14,32. DOI： 10.13296/j.1001-1609.hva.2026.09.001.

摘要

气体绝缘组合电器（GIS）与气体绝缘金属封闭输电线路（GIL）中的环氧树脂绝缘件（盆式绝缘子、支柱绝缘子等）是设备的核心部件，其长期运行可靠性面临严峻挑战。生产阶段形成的潜隐性缺陷（浅表性缺陷、界面缺陷及残余应力缺陷）是导致绝缘件开裂、击穿甚至炸裂故障的主要原因，而传统出厂试验（耐压局放、X射线、水压试验）对此类缺陷的检测能力严重不足。文中系统综述了上述3类潜隐性缺陷的形成机理，分析了气泡成核、填料沉降及界面应力失配等关键诱因；评述了太赫兹时域光谱、激光超声及声弹效应等新型无损检测技术的原理、适用性及工程化瓶颈。研究表明，现有检测技术存在明显盲区，新型检测方法虽具潜力但尚需突破检测效率、穿透深度及复杂结构适应性等难题，未来应围绕“机理厘清—检测突破—抑制优化”主线开展系统研究，为提升绝缘件制造质量与设备本质安全提供理论支撑与技术路径。

Abstract

Epoxy resin insulating parts(insulating spacers

post insulators

etc.)in gas insulated switchgear(GIS) and gas insulated transmission lines(GIL)are critical core parts of the equipment

and their long-term operational reliability faces severe challenges. Latent defects formed during the manufacturing stage(such as superficial defects

interface defects

and residual stress defects)are the main causes causing cracking

breakdown

and even rupture of insulating parts. While

the conventional factory tests

including withstand voltage partial discharge test

X-ray inspection

and hydrostatic pressure test

are severely inadequate in detecting such defects. In this paper the formation mechanisms of these three types of latent defects are systematically reviewed

with emphasis placed in the key inducing factors such as bubble nucleation

filler sedimentation

and interfacial stress mismatch. Moreover

the principles

applicability

and engineering bottlenecks of such novel non-destructive testing techniques as terahertz time-domain spectroscopy

laser ultrasound

and the acoustoelastic effect are reviewed. The research indicates that existing detection techniques have significant blind spots. Although emerging detection methods show potential

they still face challenges in terms of detection efficiency

penetration depth

and adaptability to complex structures. Future efforts should be directed toward systematic research along the main line of“mechanism clarification-detection break-through-inhibition optimization”

so as to provide theoretical support and technical pathways for improving the manufacturing quality of insulation components and the intrinsic safety of equipment.

关键词

Keywords

references

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