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Numerical Simulation of Temperature Field in Curing Process for Epoxy Resin Dry-type Transformer Winding
更新时间:2025-04-26
    • Numerical Simulation of Temperature Field in Curing Process for Epoxy Resin Dry-type Transformer Winding

    • High VoltageApparatus   Issue 5, Pages: 385-388(2008)
    • CLC: TM412
    • Published:2008

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  • Numerical Simulation of Temperature Field in Curing Process for Epoxy Resin Dry-type Transformer Winding[J]. High voltageapparatus, 2008, (5): 385-388. DOI:

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