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Supervisory Analysis on Nondestructive Inspection of Welding Bond for UHV HGIS Enclosure
更新时间:2025-04-26
    • Supervisory Analysis on Nondestructive Inspection of Welding Bond for UHV HGIS Enclosure

    • High VoltageApparatus   Vol. 45, Issue 6, Pages: 140-141+144(2009)
    • CLC: TG441.7
    • Published:2009

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  • CHEN Shou-ju, ZHANG Xiao-peng, CHEN Shang-ji, et al. Supervisory Analysis on Nondestructive Inspection of Welding Bond for UHV HGIS Enclosure[J]. High voltageapparatus, 2009, 45(6): 140-141+144. DOI:

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