Surface Characterization and Failure Mechanism of CuW Contact Material under the Stress of Electrical Arc

您当前的位置：

首页 >

文章列表页 >

更新时间：2025-04-26

- Surface Characterization and Failure Mechanism of CuW Contact Material under the Stress of Electrical Arc
- High VoltageApparatus Issue 3, Pages: 231-232+234(2004)
- 作者机构：
  
  1. 西安理工大学材料学院,西安理工大学材料学院,中国人民解放军第5702工厂,西安福莱电工合金有限公司陕西西安710048
  2. 天津市维杰电器设备开发有限公司,天津300051,陕西西安710048,陕西武功712201,陕西西安710300
- 作者简介：
- 基金信息：
- DOI：
  CLC： TM503
- Published：2004
- 稿件说明：
移动端阅览
[1]同建辉,徐锦峰,李英挺,何东继.电弧作用下铜钨触头材料表面特征及失效机理[J].高压电器,2004(03):231-232+234.

TONG Jian-hui1, XU Jin-feng1, LI Ying-ting3, et al. Surface Characterization and Failure Mechanism of CuW Contact Material under the Stress of Electrical Arc[J]. High voltageapparatus, 2004, (3): 231-232+234.
[1]同建辉,徐锦峰,李英挺,何东继.电弧作用下铜钨触头材料表面特征及失效机理[J].高压电器,2004(03):231-232+234. DOI：

TONG Jian-hui1, XU Jin-feng1, LI Ying-ting3, et al. Surface Characterization and Failure Mechanism of CuW Contact Material under the Stress of Electrical Arc[J]. High voltageapparatus, 2004, (3): 231-232+234. DOI：

阐述了型式试验后铜钨触头材料表面特征

得出铜钨触头材料在电弧作用下产生龟裂纹、裂纹、铜液态孔的主要失效机理及原因

并提出增加触头寿命的措施。

This paper introduces the surface characterizations of CuW contact materials after type test. That is particularly

forming chappy

crack and Cu jet voids. The failure mechanism is discussed. The measures to improve the electrical endurance of CuW contact materials is suggested.

Views

349

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Analysis of Operational Failure and Reliability for Type C954 High Voltage Te rylene Capacitor

Aging Characteristics and Failure Mechanism of Epoxy Resin in Humid and Hot Environment

Related Author

CHEN Yong

HE Cheng-ji

LI Guangmao

DU Gang

ZHOU Hongling

YANG Jie

PANG Zhikai

CHEN Lu

Related Institution

China Academy of Engineering Physics

中国工程物理研究院电子工程研究所四川绵阳621900

Guangzhou Power Supply Bureau,Guangdong Power Grid Co.,Ltd.

⁰