NEW MATERIAL AND ITS TREATMENT TECHNOLOGY FOR PULSED CAPACITOR

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NEW MATERIAL AND ITS TREATMENT TECHNOLOGY FOR PULSED CAPACITOR

更新时间：2025-04-26

- NEW MATERIAL AND ITS TREATMENT TECHNOLOGY FOR PULSED CAPACITOR
- High VoltageApparatus Issue 6, Pages: 31-33+37(2002)
- 作者机构：
  
  1. 华中科技大学电气与电子工程学院
  2. 华中科技大学电气与电子工程学院湖北武汉430074
- 作者简介：
- 基金信息：
- DOI：
  CLC： TM53
- Published：2002
- 稿件说明：
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[1]林福昌,徐智安,代新,戴玲,何磊,李化,李劲.新型电容器材料和处理方法[J].高压电器,2002(06):31-33+37.

NEW MATERIAL AND ITS TREATMENT TECHNOLOGY FOR PULSED CAPACITOR[J]. High voltageapparatus, 2002, (6): 31-33+37.
[1]林福昌,徐智安,代新,戴玲,何磊,李化,李劲.新型电容器材料和处理方法[J].高压电器,2002(06):31-33+37. DOI：

NEW MATERIAL AND ITS TREATMENT TECHNOLOGY FOR PULSED CAPACITOR[J]. High voltageapparatus, 2002, (6): 31-33+37. DOI：

摘要

根据碰撞电离退陷阱理论指出了提高脉冲电容器绝缘介质工作场强的方向

并介绍了电容器多层绝缘结构、复合膜及绝缘材料的等离子体处理方法

对复合材料和等离子体的要求进行了分析。

Abstract

According to the impact ionization de-trapping theory

this paper i nd icates the direction of elevating the breakdown strength of dielectrics of capac itors. Some treatment methods on film’s surface are introduced.

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Related Institution

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大连理工大学电气工程与应用电子技术系黑龙江哈尔滨 150001 大连理工大学电气工程与应用电子技术系

辽宁大连116024

Institute of Electronic Engineering, China Academy of Engineering Physics

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