EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS

WANG Ya  ping; DING Bing  jun

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EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS

更新时间：2025-04-26

- EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS
- High VoltageApparatus Issue 1, Pages: 4-7(2002)
- 作者机构：
  
  1. 西安交通大学材料科学与工程学院
  2. 西安交通大学材料科学与工程学院陕西西安710049
- 作者简介：
- 基金信息：
- DOI：
  CLC： TM503.5
- Published：2002
- 稿件说明：
移动端阅览
[1]王亚平,丁秉钧.CuCr触头合金热扩散率的实验研究[J].高压电器,2002(01):4-7.

WANG Ya ping, DING Bing jun. EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS[J]. High voltageapparatus, 2002, (1): 4-7.
[1]王亚平,丁秉钧.CuCr触头合金热扩散率的实验研究[J].高压电器,2002(01):4-7. DOI：

WANG Ya ping, DING Bing jun. EXPERIMENTAL STUDY OF THERMAL DIFFUSIVITY FOR CuCr CONTACT ALLOYS[J]. High voltageapparatus, 2002, (1): 4-7. DOI：

摘要

用激光脉冲法测试了不同晶粒尺寸的CuCr合金和纯Cr样品的热扩散率

结果表明

高能球磨及真空热压方法制备的纳米晶材料的热扩散率较常规粗晶材料显著降低

Abstract

The thermal diffusivities for CuCr alloys and pure Cr samples with different grain size are measured by laser pulse method. The results show that the thermal diffusivities for nanocrystalline samples prepared by high energy milling and hot press procedures are obviously lower than those for conventional materials.

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