WANG Jiang, ZHANG Chengyu, ZHANG Hui, et al. PREPARATION OF CuCr25 ALLOY THROUGH VACUUM INDUCING SMELTING[J]. High voltageapparatus, 2001, (2): 14-17.DOI:
PREPARATION OF CuCr25 ALLOY THROUGH VACUUM INDUCING SMELTING
摘要
本文采用真空感应熔炼法制备CuCr2 5W1Ni2合金
研究了不同成分 (2 5 %Cu及 75 %Cu)和Cr晶粒尺寸对物理性能和击穿电压的影响
讨论了合金元素和微观结构对CuCr2 5W1Ni2合金电击穿性能的影响。研究结果表明
W粉能够显著细化Cr相
同时对Cr相进行了强化 ;在电击穿后
熔层中极细的W粉能起到非自发形核核心的作用
CuCr2 5W1Ni2的熔层表面更加扁平 ;另一方面
Ni能够促进Cu、Cr的互溶
使合金整体得以强化。这两种元素均能显著提高合金的耐电压强度。
Abstract
The preparation of CuCr25W1Ni2 Alloy by vacuum inducing smelting is presented in this paper. The influence of different content (25%Cu and 75%Cu) and Cr crystalline grain on the physical properties and the breakdown voltage is studied. The discussion about the effect of alloy element and microstructure on the breakdown voltage of CuCr25W1Ni2 alloy is done too. Some results to improve the voltage withstanding stress of alloy are obtained.