Development of Contact Materials for Low-operating-power Vacuum Switches

ZHENG Wei1; WANG Ya-ping1; WANG Yong-sheng2; WANG Hui-xin2

doi:10.13296/j.1001-1609.hva.2010.10.016

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Development of Contact Materials for Low-operating-power Vacuum Switches

更新时间：2025-04-26

- Development of Contact Materials for Low-operating-power Vacuum Switches
- High VoltageApparatus Vol. 46, Issue 10, Pages: 69-74(2010)
- 作者机构：
  
  1. 西安交通大学理学院物质非平衡合成与调控教育部重点实验室
  2. 辽宁金力源新材料有限公司
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2010.10.016
  CLC： TM564
- Published：2010
- 稿件说明：
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[1]郑炜,王亚平,王永胜,王慧馨.低操作功真空开关触头材料的研究进展[J].高压电器,2010,46(10):69-74.

ZHENG Wei1, WANG Ya-ping1, WANG Yong-sheng2, et al. Development of Contact Materials for Low-operating-power Vacuum Switches[J]. High voltageapparatus, 2010, 46(10): 69-74.
[1]郑炜,王亚平,王永胜,王慧馨.低操作功真空开关触头材料的研究进展[J].高压电器,2010,46(10):69-74. DOI： 10.13296/j.1001-1609.hva.2010.10.016.

ZHENG Wei1, WANG Ya-ping1, WANG Yong-sheng2, et al. Development of Contact Materials for Low-operating-power Vacuum Switches[J]. High voltageapparatus, 2010, 46(10): 69-74. DOI： 10.13296/j.1001-1609.hva.2010.10.016.

摘要

小型化、高容量、智能化是真空开关发展的趋势

这对开关系统的操动机构提出了新的要求

低操作功真空开关应运而生。小型化、高容量、低操作功真空开关的发展很大程度上决定于触头材料性能的不断提高

低工作压力的真空开关要求触头在保证高的开断能力的同时必须具有低的熔焊倾向。笔者在展望低操作功真空开关开发前景的基础上

综述了低操作功真空开关触头材料的研究成果

提出新一代具有极高抗熔焊性能的CuCr系材料是低操作功真空开关触头的发展方向。

Abstract

It is imperative for the further development of contact materials

which should have strong resistance to weld while keeping high breaking capacity

with the advances of miniaturization

high capacity and intelligence of vacuum switches.This paper summarized research results of the contact materials for the vacuum switches with low operating power.It put forward that the new generation of CuCr material with high anti-welding performance is the best potential contact for the low-operating-power vacuum switches.

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