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Analyzing Decomposition Products in Overheat Faults Simulation to Evaluate SF6 Gas Insulation Device
更新时间:2025-04-26
    • Analyzing Decomposition Products in Overheat Faults Simulation to Evaluate SF6 Gas Insulation Device

    • High VoltageApparatus   Vol. 47, Issue 1, Pages: 62-69(2011)
    • DOI:10.13296/j.1001-1609.hva.2011.01.015    

      CLC: TM507
    • Published:2011

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  • WANG Yu, LI Li, YAO Wei-jian, et al. Analyzing Decomposition Products in Overheat Faults Simulation to Evaluate SF6 Gas Insulation Device[J]. High voltageapparatus, 2011, 47(1): 62-69. DOI: 10.13296/j.1001-1609.hva.2011.01.015.

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