Bonding Strength Comparison of the Epoxy Bonded Hollow Porcelain Insulators Suffered Different Artificial Environments

LI Juan1; WU Xue-feng1; HONG Guo-yao1; DONG Xiao-rong1; TANG Hua-long2

doi:10.13296/j.1001-1609.hva.2011.01.017

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Bonding Strength Comparison of the Epoxy Bonded Hollow Porcelain Insulators Suffered Different Artificial Environments

更新时间：2025-04-26

- Bonding Strength Comparison of the Epoxy Bonded Hollow Porcelain Insulators Suffered Different Artificial Environments
- High VoltageApparatus Vol. 47, Issue 1, Pages: 75-79(2011)
- 作者机构：
  
  1. 西安西电高压开关有限责任公司
  2. 比彼西(上海)贸易有限公司
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2011.01.017
  CLC： TM216
- Published：2011
- 稿件说明：
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[1]李娟,吴雪峰,洪国耀,董晓荣,汤华龙.瓷套环氧粘接试棒人工环境条件影响下的粘接强度对比试验[J].高压电器,2011,47(01):75-79.

LI Juan1, WU Xue-feng1, HONG Guo-yao1, et al. Bonding Strength Comparison of the Epoxy Bonded Hollow Porcelain Insulators Suffered Different Artificial Environments[J]. High voltageapparatus, 2011, 47(1): 75-79.
[1]李娟,吴雪峰,洪国耀,董晓荣,汤华龙.瓷套环氧粘接试棒人工环境条件影响下的粘接强度对比试验[J].高压电器,2011,47(01):75-79. DOI： 10.13296/j.1001-1609.hva.2011.01.017.

LI Juan1, WU Xue-feng1, HONG Guo-yao1, et al. Bonding Strength Comparison of the Epoxy Bonded Hollow Porcelain Insulators Suffered Different Artificial Environments[J]. High voltageapparatus, 2011, 47(1): 75-79. DOI： 10.13296/j.1001-1609.hva.2011.01.017.

摘要

对人工模拟环境条件下作用过的有机环氧粘接瓷套随炉试棒开展抗弯对比试验

应用方差分析统计手段对试验结果进行检验

判别人工模拟环境因素是否对瓷套粘接面强度会造成显著性影响。试验和分析结果表明

高低温、水浸泡、紫外线辐射、臭氧及1%氢氟酸浸蚀对试棒粘接面无显著性影响

只有5%氢氟酸浸蚀试验会对粘接强度构成显著性影响。

Abstract

The epoxy bonded hollow insulator samples suffered different artificial environments were tested to compare their bonding strength in terms of bending strength.The samples were made of the same material as the 550 kV hollow insulator.The test data were processed with variance analysis.The results show that the artificial environments of high/low temperature

water immersion

ultraviolet radiation

ozone and 1% hydrofluoric acid solution impose no significant effect on the surface of the samples

however

5% hydrofluoric acid solution imposes significant effect on the bonding strength of the samples.

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Key Laboratory of High Voltage & EMC,North China Electric Power University

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