Rapid solidification technology is an important technique for preparing fine-grain and superfine-grain Cu-Cr alloys

including melt-spinning

atomization

spray deposition and laser technology

etc.The grain sizes of the Cu-Cr alloys thus prepared could be reduced from hundreds of micrometers to several micrometers or even to less than 100 nanometers

so that the overall performance of Cu-Cr alloys can be improved.In order to facilitate the preparation of the fine-grain or superfine-grain Cu-Cr alloys

we summarize the researches and applications of the rapid solidification methods to Cu-Cr contact materials for high-voltage and vacuum condition

and compare their technical features.