JIA Yi-fan, WANG Bo, LU Yao, et al. Research on Temperature-rise Test Method of Switchgear[J]. High voltageapparatus, 2013, 49(8): 87-91. DOI: 10.13296/j.1001-1609.hva.2013.08.015.
Research on Temperature-rise Test Method of Switchgear
The objective of this paper is to study a feasibility of an equivalent method of a temperature-rise test for a single of AC metal-clad switchgear and controlgear(switchgear
for short) to substitute for a normal temperature-rise test conducted in one middle-switchgear of several parallel switchgears.Based on this equivalent test method
a temperature-rise test was conducted on an indoor metal-clad enclose switchgear and controlgear.Based on a specification of a temperature-rise test duty of type-test in standards of GB/T 11022—2011 and GB 3906—2006
an experiment of temperature-rise test
as specified in type-test
was conducted in a metal enclosed switchgear and three parallel switchgears
respectively.And a comparing experiment was conducted in a metal-clad enclosed switchgear
based on this equivalent test method
later then.Experiment result shows: the feasibility of the equivalent temperature-rise test method was verified by a 0.6 K tolerance in key points
when the equivalent test method conducted in single switchgear was used to substitute for a normal temperature-rise test conducted in one middle-switchgear of three parallel switchgears.For an experiment of two-layer structure switchgear
two ways of current conducting were applied
one way was to take the middle terminal as the current flowing input while both the upper and lower terminals were taken as the current flowing output
the other way was to take the upper terminal as current flowing input while the lower terminal was taken as current flowing output.Experiment result shows the temperature-rise conditions of some key points
in this metal-clad enclosed switchgear
the former way of current conducting is more severe than the latter.