LIAO Yifan, PANG Meiqin, GU Fengbiao, et al. Discussion on the Tests for Compact Assembling Shunt Capacitor[J]. High voltageapparatus, 2014, 50(9): 41-46.
LIAO Yifan, PANG Meiqin, GU Fengbiao, et al. Discussion on the Tests for Compact Assembling Shunt Capacitor[J]. High voltageapparatus, 2014, 50(9): 41-46. DOI: 10.13296/j.1001-1609.hva.2014.09.009.
Discussion on the Tests for Compact Assembling Shunt Capacitor
According to the characteristics of the compact assembling shunt capacitor
a series of tests are analyzed
including the discharge test of assembling shunt capacitor body with YN connection
the temperature rise test
the device temperature rise test
the discharge coil error test
the induction withstand voltage test
and the withstand voltage test of capacitor’s secondary terminal to the ground. Conclusion is drawn from the analysis of the discharge test that the discharge test should be conducted on separate phase instead of on shunted three phases. Through the analyses on the temperature rise test of the assembling shunt capacitor body and the device
a feasible test method is proposed for the present test condition. According to the test results
it is suggested that the error test of discharge coil should be performed after the discharge coil is installed in the capacitor
and the ground withstand voltage test should be conducted once more for the assembling capacitor’s secondary terminals
while the rest tests for discharge coil are conducted before its installation.