SHAO Xianjun, HE Wenlin, XU Hua, et al. Location and Analysis of Discharge Failures in 550kV GIS During Field Withstanding AC Voltage Test[J]. High voltageapparatus, 2014, 50(11): 30-37.
SHAO Xianjun, HE Wenlin, XU Hua, et al. Location and Analysis of Discharge Failures in 550kV GIS During Field Withstanding AC Voltage Test[J]. High voltageapparatus, 2014, 50(11): 30-37. DOI: 10.13296/j.1001-1609.hva.2014.11.006.
Location and Analysis of Discharge Failures in 550kV GIS During Field Withstanding AC Voltage Test
By combing the ultrasonic online monitoring and the measurement of discharge voltage value and SF6 decomposition products
four discharge failures in 550 kV GIS during withstanding AC voltage field test are located and analyzed. The main causes of the flashover on cone-type spacer surface are discussed. The relationship among surface flashover
partial discharge of defects
and surface charge transport are investigated. It is concluded that:1)the metal particles on the surface of conevtype spacer tend to initiate negative corona and accumulate negative surface charge
thus to intensify the distortion of the surface electric field and supply the required charge for discharge channel propagation; and 2)when the contacts between cone-type spacer and electrodes is insufficient
the surface discharge originates from the dielectric barrier corona at triple-junction points
while the corona propagation and the charged particles’ drift and diffusion movement become the precondition to generate surface discharge. In addition
some suggestions are offered
concerning GIS field assemblage
ultrasonic location of failure
and the related experimental and theoretical researches.