The copper vapor resulting from electrode surfaces in switch devices

such as high-voltage circuit breakers

may modify the characteristics of arc plasmas. The corresponding properties of plasmas contaminated by the metallic vapor are therefore needed to be determined before setting up physical models considering the metal erosion. In this paper

the physical property parameters

including the equilibrium compositions

thermodynamic properties

transport coefficients

and combined diffusion coefficients of SF

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-Cu mixtures are calculated at temperatures of 300-30

000 K and a pressure of 0.6 MPa based on the Gibbs energy minimization

and ChapmanEnskog theory. The influences of copper proportion（up to 90%）on such properties are investigated. It is found that a small quantity of copper has no significant influence on the above thermo-physical properties of SF

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-Cu mixtures

while a large quantity of copper

can generally change these properties dramatically when the content is more than 30%.