Fatigue Life Prediction of Bonding Wires in IGBT Modules Based on Case Temperature

ZHAO Xuzhou; ZHU Ge; WU Xin

doi:10.13296/j.1001-1609.hva.2017.07.027

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Fatigue Life Prediction of Bonding Wires in IGBT Modules Based on Case Temperature

更新时间：2025-04-26

- Fatigue Life Prediction of Bonding Wires in IGBT Modules Based on Case Temperature
- High VoltageApparatus Vol. 53, Issue 7, Pages: 167-173(2017)
- 作者机构：
  
  1. 三峡大学电气与新能源学院
  2. 雅砻江流域水电开发有限公司
  3. 国网安徽省电力公司马鞍山供电公司
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2017.07.027
  CLC： TN322.8
- Published：2017
- 稿件说明：
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[1]赵旭州,朱戈,吴馨.基于壳温的IGBT模块键合引线疲劳寿命预测[J].高压电器,2017,53(07):167-173.

ZHAO Xuzhou, ZHU Ge, WU Xin. Fatigue Life Prediction of Bonding Wires in IGBT Modules Based on Case Temperature[J]. High voltageapparatus, 2017, 53(7): 167-173.
[1]赵旭州,朱戈,吴馨.基于壳温的IGBT模块键合引线疲劳寿命预测[J].高压电器,2017,53(07):167-173. DOI： 10.13296/j.1001-1609.hva.2017.07.027.

ZHAO Xuzhou, ZHU Ge, WU Xin. Fatigue Life Prediction of Bonding Wires in IGBT Modules Based on Case Temperature[J]. High voltageapparatus, 2017, 53(7): 167-173. DOI： 10.13296/j.1001-1609.hva.2017.07.027.

摘要

为了研究功率循环下键合引线的疲劳寿命

提高IGBT模块的可靠性

文中提出了一种基于壳温的键合引线寿命预测方法。首先对IGBT模块进行功率循环测试

探究了键合引线的疲劳失效机理;然后建立IGBT模块的电—热—结构强耦合模型

分析了模块在功率循环载荷下的电、热、结构特性。依据键合引线的应变情况和实验测得的疲劳曲线

评估键合引线的疲劳寿命

并在壳温基础上建立了其寿命预测模型

对比测试结果验证了该模型的准确性;最后提出了铜键合引线的改进方案。根据易测量的壳温来确定键合引线的使用寿命

提前更换器件

能降低IGBT模块的故障率。

Abstract

To study the fatigue life of bonding wires and improve the reliability of IGBT modules

this paper proposes a new life prediction method based on case temperature. Firstly the failure mechanism of IGBT modules is investigated by power cycling test

and the electro-thermal-structural strong coupling model is developed to study physical behavior of IGBT modules under power cycling. Based on the calculated result of structural field

the corresponding fatigue failure criterion is adopted for the different strain of bonding wires to calculate its fatigue life.The life prediction model of bonding wires is built on the case temperature

and the accuracy of the model is demonstrated by the experimental results. Finally the improved scheme of copper bonding wire is presented. According to the case temperature which is easy to measure

the service life of bonding wires can be determined to develop the operation strategy

which is beneficial to reduce the failure rate of IGBT modules.

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