Detection and Disassembly Analysis on an Abnormal Heat Fault of 220 kV GIS Equipment

HE Liang; WANG Hongmei; ZHANG Xubo; DING Dengwei; WANG Jiayi; ZHOU Dianbo

doi:10.13296/j.1001-1609.hva.2018.06.036

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Detection and Disassembly Analysis on an Abnormal Heat Fault of 220 kV GIS Equipment

更新时间：2025-04-26

- Detection and Disassembly Analysis on an Abnormal Heat Fault of 220 kV GIS Equipment
- High VoltageApparatus Vol. 54, Issue 6, Pages: 236-240+247(2018)
- 作者机构：
  
  1. 国网四川电科院
  2. 国网四川省电力公司
  3. 国网四川检修公司
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2018.06.036
  CLC： TM595
- Published：2018
- 稿件说明：
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[1]何良,王红梅,张旭波,丁登伟,王嘉易,周电波.一起220 kV GIS设备发热异常检测及解体分析实例[J].高压电器,2018,54(06):236-240+247.

HE Liang, WANG Hongmei, ZHANG Xubo, et al. Detection and Disassembly Analysis on an Abnormal Heat Fault of 220 kV GIS Equipment[J]. High voltageapparatus, 2018, 54(6): 236-240+247.
[1]何良,王红梅,张旭波,丁登伟,王嘉易,周电波.一起220 kV GIS设备发热异常检测及解体分析实例[J].高压电器,2018,54(06):236-240+247. DOI： 10.13296/j.1001-1609.hva.2018.06.036.

HE Liang, WANG Hongmei, ZHANG Xubo, et al. Detection and Disassembly Analysis on an Abnormal Heat Fault of 220 kV GIS Equipment[J]. High voltageapparatus, 2018, 54(6): 236-240+247. DOI： 10.13296/j.1001-1609.hva.2018.06.036.

摘要

介绍了一起220 kV GIS设备出线管母发热异常的分析处理过程。通过对红外测温、局放特高频检测、局放超声波检测、SF

成分检测等结果的分析

认为触头接触不良是导致发热异常的主要原因。经解体检查

发现导电杆与触指间存在明显刮痕

出线管母安装工艺不良导致电流不能均匀流过触指

从而引起发热异常。该起案例表明仅仅通过传统的回路电阻测试并不一定能有效发现接触不良缺陷

需结合其他检测手段进行综合评估。该次GIS设备异常的处理经验

为今后类似异常的处理分析提供借鉴与参考。

Abstract

A typical abnormal heat fault of 220 kV GIS equipment was analyzed. Infrared diagnosis technology

UHF detection method

ultrasonic detection method and SF

decomposition component detection were adopted to diagnose the fault

and it was found that the fault may be caused by poor contact of GIS. Disassembly inspection showed that there were obvious scratches on conducting rub and static contact

and that current could not flow across the static contact evenly due to imperfect installation of the outlet bus

leading to the abnormal heat fault. This study indicates that only measuring circuit resistance is insufficient for finding the defect of poor contact

so comprehensive detection is necessary by combining other detection methods.

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