ZHANG Xingtao, WU Guangning, WU Xuhui, et al. Plasma Modification of Polyimide Film and Its Mechanism[J]. High voltageapparatus, 2019, 55(9): 208-214. DOI: 10.13296/j.1001-1609.hva.2019.09.028.
Plasma Modification of Polyimide Film and Its Mechanism
To investigate the surface modification of polyimide(PI)film via dielectric barrier discharge(DBD)in air
a dielectric barrier discharge platform was built to measure the electrical characteristics of DBD of different materials under different air gap distances and to obtain corresponding discharge images
and a uniform DBD discharge mode was achieved.Then
PI films were treated with different time using the plasma
and the contact angle
surface energy and Fourier transform infrared spectra(FTIR)were measured.The action mechanism of plasma was also revealed.The results show that:1)ceramic barrier can achieve more uniform discharge than glass orepoxy resin barrier;2)with the increase of the air gap distance between ceramics
the duration and uniformity of discharge decrease
but the discharge power density is on the contrary
and smaller air gap distance is more suitable for polymer surface modification;3)with the increase of plasma treatment time
the contact angle of PI thin film decreases and the surface energy increases;and 4)the polar hydrophilic groups introduced to the surface of PI thin films
such as-OH andwell as the increase of roughness caused by plasma etching
are the main reasons for the increase of hydrophilicity and surface energy of PI films.