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Review on Aging Mechanism and Condition Monitoring of Devices in MMC Sub-module
更新时间:2025-04-26
    • Review on Aging Mechanism and Condition Monitoring of Devices in MMC Sub-module

    • High VoltageApparatus   Vol. 56, Issue 1, Pages: 1-8(2020)
    • DOI:10.13296/j.1001-1609.hva.2020.01.001    

      CLC: TM721.1
    • Published:2020

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  • ZHANG Jian, CHEN Rui, CHEN Shiying, et al. Review on Aging Mechanism and Condition Monitoring of Devices in MMC Sub-module[J]. High voltageapparatus, 2020, 56(1): 1-8. DOI: 10.13296/j.1001-1609.hva.2020.01.001.

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