Discussion on Temperature Rise Control of Medium-voltage Switchgear Based on Temperature Rise Test

WU Xingtan; ZHOU Peng; LIU Shaopeng; LIU Yuncai; ZHANG Tuanjie

doi:10.13296/j.1001-1609.hva.2020.10.015

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Discussion on Temperature Rise Control of Medium-voltage Switchgear Based on Temperature Rise Test

更新时间：2025-04-26

- Discussion on Temperature Rise Control of Medium-voltage Switchgear Based on Temperature Rise Test
- High VoltageApparatus Vol. 56, Issue 10, Pages: 93-97(2020)
- 作者机构：
  
  1. 许继电气股份有限公司
  2. 国网河南省电力公司
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2020.10.015
  CLC： TM591
- Published：2020
- 稿件说明：
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[1]武兴坛,周鹏,刘少鹏,刘云才,张团结.基于温升试验的中压开关柜温升控制探讨[J].高压电器,2020,56(10):93-97.

WU Xingtan, ZHOU Peng, LIU Shaopeng, et al. Discussion on Temperature Rise Control of Medium-voltage Switchgear Based on Temperature Rise Test[J]. High voltageapparatus, 2020, 56(10): 93-97.
[1]武兴坛,周鹏,刘少鹏,刘云才,张团结.基于温升试验的中压开关柜温升控制探讨[J].高压电器,2020,56(10):93-97. DOI： 10.13296/j.1001-1609.hva.2020.10.015.

WU Xingtan, ZHOU Peng, LIU Shaopeng, et al. Discussion on Temperature Rise Control of Medium-voltage Switchgear Based on Temperature Rise Test[J]. High voltageapparatus, 2020, 56(10): 93-97. DOI： 10.13296/j.1001-1609.hva.2020.10.015.

摘要

针对KYN28A—12型交流金属封闭开关设备温升超标问题

基于温升试验结果分析了影响开关柜温升的因素

并提出优化设计方法和解决措施。通过三维建模及有限元分析

得到开关柜三维温度场和流场的分析结果

确定了以改善开关柜触头盒内部流场作为降低温升的主要措施

并设计了一种改善开关柜内流场分布的导流装置。经试验

温升符合有关标准要求

并验证了提升触头盒内部流场可以有效降低开关柜有关位置的温升。

Abstract

Aiming at the temperature rise in excess problem of KYN28A-12 AC metal-enclosed switchgear

the factors influencing the temperature rise of the switchgear are analyzed by the test

the optimization design methods and solution measures are proposed.The analysis results of the temperature field and the flow field of the switchgear are obtained by the finite element analysis based on 3D modeling

and it is determined that the main measures to reduce the temperature rise are to improve the internal flow field of the contact box of the switchgear.A diversion device for improving the distribution of flow field in switchgear is designed.The temperature rise meets the standard requirements by the test

it’s verified that lifting the internal flow field of the contact box can effectively reduce the temperature rise in the relevant position of the switchgear.

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