Thermoplastic materials

such as polyamide

can be used as electrical insulation material in various high voltage applications

due to their environmentally friendly

rapid

low-energy cost and recyclable processing

in combination with enhanced mechanical and electrical properties

compared to the traditional thermisetting epoxy.IEEE standard for air switchgear claimed that the insulating material should have good tracking and erosion performance.However

there are few researches on the inclined plane test of thermoplastic materials.This paper investigates the erosion resistance of micron-Al

2

O

3

and micron-BN filled glass fiber reinforced polyamide through failure time

mass loss

thermal conductivity.The results show that the two inorganic fillers can improve the tracking performance of polyamide.Better thermal stability and thermal conduction ability can be possible reasons for the better performance of hybrid filled composites in IPT.When the contents of BN fillers are more than 30%

the composite materials can pass the 2.5 kV inclined plate test and meet the requirements of IEEE standard.