FU Chenzhao, LI Honglei, ZHANG Zhenpeng, et al. Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable[J]. High voltageapparatus, 2021, 57(2): 159-165.
FU Chenzhao, LI Honglei, ZHANG Zhenpeng, et al. Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable[J]. High voltageapparatus, 2021, 57(2): 159-165. DOI: 10.13296/j.1001-1609.hva.2021.02.022.
Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable
For improving the convenience and accuracy of transient temperature rise of cable
a new lumped parame-ter model is proposed and verified through simulation calculation in this paper[1]. For further verification of the mod-el structure and the credibility of parameter extraction method and identification of the problem in the model applica-tion in practice
the cable for two types and different position temperature evaluation is selected to perform the realtest study. During the test period
the errors of both calculation result of the model and the real test result are lessthan 3 K
which can meet the operation need. It is shown by the verified test result that the model structure is reason-able and the parameter extraction method is credible. The data base for parameter extraction is from not only simula-tion calculation
but also from the actually measured data which
in turn
enriches the data source
also avoids theinfluence of the complexity of ambient structure on the numerical simulation accuracy
thus improving the suitabilityof the model to the complicated environment. In view of the need of transient temperature analysis of different posi-tions
the original thermal circuit model can be adjusted flexibly. The parameter solution method remains unchangedand the convenience and accuracy of the model are free from influence.