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Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable
更新时间:2025-04-26
    • Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable

    • High VoltageApparatus   Vol. 57, Issue 2, Pages: 159-165(2021)
    • DOI:10.13296/j.1001-1609.hva.2021.02.022    

      CLC: TM75
    • Published:2021

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  • FU Chenzhao, LI Honglei, ZHANG Zhenpeng, et al. Verification Test for Thermal Circuit Model of Transient Temperature Rise of Soil Direct Buried Single Cable[J]. High voltageapparatus, 2021, 57(2): 159-165. DOI: 10.13296/j.1001-1609.hva.2021.02.022.

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