Preliminary Development of Micro-stack Insulator and Study of Its Flashover Characteristic

RAN Huijuan; ZHANG Jinliang; GENG Zhaoyang; SONG Yanze; WANG Meng; WANG Jue; YAN Ping

doi:10.13296/j.1001-1609.hva.2021.08.002

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Preliminary Development of Micro-stack Insulator and Study of Its Flashover Characteristic

更新时间：2025-04-26

- Preliminary Development of Micro-stack Insulator and Study of Its Flashover Characteristic
- High VoltageApparatus Vol. 57, Issue 8, Pages: 10-16(2021)
- 作者机构：
  
  1. 华北电力大学电力工程系
  2. 中国科学院电工研究所
  3. 中国科学院电力电子与电力驱动重点实验室
- 作者简介：
- 基金信息：
- DOI：10.13296/j.1001-1609.hva.2021.08.002
  CLC： TM216
- Published：2021
- 稿件说明：
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RAN Huijuan, ZHANG Jinliang, GENG Zhaoyang, et al. Preliminary Development of Micro-stack Insulator and Study of Its Flashover Characteristic[J]. High voltageapparatus, 2021, 57(8): 10-16.
DOI：

RAN Huijuan, ZHANG Jinliang, GENG Zhaoyang, et al. Preliminary Development of Micro-stack Insulator and Study of Its Flashover Characteristic[J]. High voltageapparatus, 2021, 57(8): 10-16. DOI： 10.13296/j.1001-1609.hva.2021.08.002.

摘要

为满足脉冲功率设备高性能、小型化的应用需求

文中研制出以尼龙为绝缘层

铜粉导电胶和导电银胶分别为导电层的两种微堆层绝缘子

文中详细介绍了样品的制备过程和表面处理工艺。采用自主搭建的纳秒脉冲电源MPC-50D(上升沿50 ns

半高宽56 ns)对微堆层绝缘子的真空沿面闪络性能进行测试

并将测试结果与常规绝缘子闪络特性进行对比。结果表明

采用此工艺制备的微堆层绝缘子

最高绝缘强度至少提高了34%;具有相同导电层时

采用导电银胶制备的绝缘子

随着绝缘层对导电层比例的增加

绝缘强度逐渐提高;比例关系相近时

铜粉导电胶制备的微堆层绝缘子性能明显优于导电银胶制备的绝缘子;拍摄的闪络电弧表明

微堆层绝缘子的沿面放电是逐级逐层击穿。

Abstract

For meeting the high performance and miniaturization application demand of pulse power equipment

two kinds of micro-stack insulators with nylon as insulation layer

copper powder conductive adhesive and silver conductive adhesive as conductive layer respectively are developed in this paper. The preparation process and the surface treatment process of the sample are introduced in detail. The self-built nanosecond pulse power supply MPC-50D（with rising edge of 50 ns and full width at half maximum（FWHM）of 56 ns）is used to test the vacuum surface flashover performance of the micro-stack insulator. The test result is compared with the flashover characteristics of conventional insulator. The results show that the maximum dielectric strength of micro-stack insulator

prepared by this technology

increases at least 34%. In case of same conductive layer

the dielectric strength of insulator prepared by conductive silver adhesives rises gradually with the increase of the ratio of insulation layer to conductive layer. In case of similar ratio relationship

the performance of the micro-stack insulator prepared by the copper powder conductive adhesive is obviously better than that prepared by the conductive silver adhesive. The flashover arc shot shows that the surface discharge of the micro-stack insulator is a step by step and layer by layer breakdown.

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