Research on Temperature Rise Characteristics of High Current Solid Insulated Switchgear Based on Multi-physical Field

HUANG Zeping; CHEN Li’an; WANG Hongyan; ZHANG Kai; ZHENG Wenfu; ZHANG Kunzhe; XIANG Xin

doi:10.13296/j.1001-1609.hva.2025.03.008

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Research on Temperature Rise Characteristics of High Current Solid Insulated Switchgear Based on Multi-physical Field

Research & Analysis | 更新时间：2025-05-25

- Research on Temperature Rise Characteristics of High Current Solid Insulated Switchgear Based on Multi-physical Field
- High Voltage Apparatus Vol. 61, Issue 3, Pages: 71-79(2025)
- 作者机构：
  
  1.厦门理工学院电气工程与自动化学院，福建　厦门　 361024
  2.厦门市高端电力装备及智能控制重点实验室，福建　厦门　 361024
  3.爱启（厦门）电气技术有限公司，福建　厦门　 361006
  4.国网福建省电力有限公司龙岩市新罗区供电公司，福建　龙岩　 364000
- 作者简介：
- 基金信息：
  
  Natural Science Foundation of Fujian Province(2023J011443)
- DOI：10.13296/j.1001-1609.hva.2025.03.008
  CLC：
- Received：14 September 2024，
  
  Revised：08 December 2024，
  
  Published：16 March 2025
- 稿件说明：
移动端阅览
HUANG Zeping, CHEN Li’an, WANG Hongyan, et al. Research on Temperature Rise Characteristics of High Current Solid Insulated Switchgear Based on Multi-physical Field[J]. High voltage apparatus, 2025, 61(3): 71-79.
DOI：

HUANG Zeping, CHEN Li’an, WANG Hongyan, et al. Research on Temperature Rise Characteristics of High Current Solid Insulated Switchgear Based on Multi-physical Field[J]. High voltage apparatus, 2025, 61(3): 71-79. DOI： 10.13296/j.1001-1609.hva.2025.03.008.

摘要

随着经济社会发展与用电需求的剧增，大电流固体开关柜的研制成了当下热点。文中以某型大电流固体开关柜为对象，通过有限元仿真软件对其三维模型进行温度—流体场仿真研究。模拟分析采用不同导热率环氧树脂、优化散热风道前后的固体柜温升分布，并通过型式试验对比验证仿真方法的有效性。研究结果表明：固体柜发热部位集中在上转接头、动触头、T型导体、软连接及真空泡动静端，其中以真空泡动端温度最高。优化后的固体柜，柜内气流流速增强，发热点温升大幅降低。研究结果为大电流固体开关柜的研制提供新的方法和思路。

Abstract

With the development of economic society and increase of demand for electricity

the development of high current solid switchgear cabinet has become a hot topic at present. In this paper

a certain type of high current solid switchgear cabinet is taken as the research object

and the temperature-flow field of its three-dimensional model is simulated through the finite element simulation software. For the simulation analysis

the epoxy resin with different thermal conductivity is used

the temperature rise distribution of the solid switchgear cabinet before and after optimization of heat dissipation air duct is optimized and effectiveness of the simulation method is compared and verified through type test. The research result shows that the heating parts of the solid switchgear cabinet are concentrated in the upper adapter

moving contact

T-type conductor

flexible connection and the dynamic and static end of the vacuum bulb

in which the dynamic end of the vacuum bulb has the highest temperature. After the optimization of the solid switchgear cabinet

the airflow velocity in the cabinet is increased and the temperature rise of the heating spot is greatly reduced. The research results provide a new method and idea for the development of high current solid switchgear cabinet.

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