WEI Wei, BAI Xiaobin, CHANG Jiang, et al. Design and Experiment Study on Separable Electromagneic Crimping Coil of Copper-aluminum Transition Joints[J]. High Voltage Apparatus, 2026, 62(4): 143-151.
DOI:
WEI Wei, BAI Xiaobin, CHANG Jiang, et al. Design and Experiment Study on Separable Electromagneic Crimping Coil of Copper-aluminum Transition Joints[J]. High Voltage Apparatus, 2026, 62(4): 143-151. DOI: 10.13296/j.1001-1609.hva.2026.04.016.
Design and Experiment Study on Separable Electromagneic Crimping Coil of Copper-aluminum Transition Joints
The magnetic field coil is a critical part of electromagnetic forming equipment
and its structure and performance influence the effect of the electromagnetic forming process. The seprable coil proposed in the present foundation study has such issues as low energy utilization and short lifetime.Therefore
to enable the application of electromagnetic forming technology in the filed of copper-aluminum transition joints
it is necessary to develope separable magentic field coil with high strength and high enerergy utilization.In this paper
the separable coil based on external magnetic collector is designed and the separable coil is used to perform the copper-aluminum joint crimping experiment study. The influence of such parameters as discharge frequency
the coil and magnetic collector structure on the forming effect and magnetic induction intensity of the working area of the magnetic collector is studied through electromagnetic-structural finite element simulation. Results from copper-aluminum transition joints crimping experiments indicate that with the increase of discharge voltage of the pulse capacitor bank
the uneven deformation of the outer tube is decreased. Moreover
the contact resistance and fluctuation range of the copper-aluminum joints are decreased
the tensile strength is increased. When the discharge voltage is above 14 kV
the strength of the copper-aluminum joints is higher than that of the aluminum stranded wire. It is found from the microscopic analysis of cable joint interfaces with discharge voltage at 14 kV and above that with an increase in collision velocity
the wavelength and peak of the wavy interface are increased. It is found from the line scans of Cu/Al welding interface that element diffusion with a length of around 2 μm is occurred without interface melting. Therefore
the bonding mechanism of the copper-aluminum joints is mainly classified into following two aspects:the formation of atomic bonding at the interface due to element diffusion
and the formation of metallurgical bonding due to intense plastic deformation caused by high-speed collision.
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