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Numerical Modeling and Analysis of Thermal-vibration Multi-field Coupling of GIS Under Different Contact Defects
Research & Analysis | 更新时间:2026-05-13
    • Numerical Modeling and Analysis of Thermal-vibration Multi-field Coupling of GIS Under Different Contact Defects

    • High Voltage Apparatus   Vol. 62, Issue 5, Pages: 21-32(2026)
    • DOI:10.13296/j.1001-1609.hva.2026.05.003    

      CLC:
    • Received:08 October 2025,

      Revised:2025-12-09,

      Published:16 May 2026

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  • WANG Yangcheng, GUAN Xiangyu, ZHAO Junyi, et al. Numerical Modeling and Analysis of Thermal-vibration Multi-field Coupling of GIS Under Different Contact Defects[J]. High Voltage Apparatus, 2026, 62(5): 21-32. DOI: 10.13296/j.1001-1609.hva.2026.05.003.

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